Japan, Feb. 12 -- SEIKO EPSON CORP has got intellectual property rights for 'LIQUID DISCHARGE HEAD AND LIQUID DISCHARGE APPARATUS.' Other related details are as follows: Application Number: JP,2022-0... Read More
Japan, Feb. 12 -- NIPPON AVIONICS CO LTD has got intellectual property rights for 'HEATING METHOD, HEATING DEVICE, AND PROGRAM.' Other related details are as follows: Application Number: JP,2022-0349... Read More
Japan, Feb. 12 -- HYMO CORP has got intellectual property rights for 'FIXATION METHOD OF ROSIN-BASED SIZE AGENT.' Other related details are as follows: Application Number: JP,2022-034909 Category (F... Read More
Japan, Feb. 12 -- SHIBA SHINTARO has got intellectual property rights for 'INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM.' Other related details are as follows: Applicatio... Read More
Japan, Feb. 12 -- FUJI ELECTRIC CO LTD has got intellectual property rights for 'SILICON CARBIDE SEMICONDUCTOR DEVICE AND SILICON CARBIDE SEMICONDUCTOR SUBSTRATE.' Other related details are as follows... Read More
Japan, Feb. 12 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'RELEASE FILM FOR SEMICONDUCTOR MOLDING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE.' Other related details are as... Read More
Japan, Feb. 12 -- DENSO CORP has got intellectual property rights for 'CONTROL DEVICE.' Other related details are as follows: Application Number: JP,2022-034213 Category (FI): G06F9/445,H02P29/028 ... Read More
Japan, Feb. 12 -- KOBE CITY HOSPITAL ORGANIZATION,INSTITUTE OF PHYSICAL & CHEMICAL RESEARCH has got intellectual property rights for 'INFORMATION PROCESSING DEVICE, ESTIMATION DEVICE, INFORMATION PROC... Read More
Japan, Feb. 12 -- FUJI ELECTRIC CO LTD has got intellectual property rights for 'POWER SOURCE CIRCUIT, ENCODER AND METHOD OF CONTROLLING POWER SOURCE CIRCUIT.' Other related details are as follows: A... Read More
Japan, Feb. 12 -- MITSUBISHI CHEMICAL CORP has got intellectual property rights for 'POLYMER COMPOSITION, ADHESIVE AND LAMINATE.' Other related details are as follows: Application Number: JP,2022-033... Read More